PN Type Package Designator Pb-Free Packages - Manufacturing Conversion Datecode, Refer to Note 1 Type of Plating / Finish Matte Tin Annealing Process Minimum Plating Thickness Does this Microchip Pb-free device meet RoHS compliance for the following 6 materials: Pb, Hg, Cr6+, Cd, and PBB / PBDE Total Mass (g) STANDARD8L DFN 2x3mmAll Date CodesMatte Tin150C / 1hr w/l 24 hours400 microinchesYes0.0170
93LC66BT-I/MC |
RFQ for 93LC66BT-I/MC |
![]() |
| Technical/Catalog Information | 93LC66BT-I/MC |
| Vendor | Microchip Technology |
| Category | Integrated Circuits (ICs) |
| Memory Type | EEPROM |
| Memory Size | 4K (256 x 16) |
| Speed | 2MHz |
| Interface | Microwire, 3-Wire Serial |
| Package / Case | 8-DFN |
| Packaging | Tape & Reel (TR) |
| Voltage - Supply | 2.5 V ~ 5.5 V |
| Operating Temperature | -40°C ~ 85°C |
| Format - Memory | EEPROMs - Serial |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | 93LC66BT I MC 93LC66BTIMC 93LC66BT I MCTR ND 93LC66BTIMCTRND 93LC66BT-I/MCTR |
| Product | Manufacturers | Pack | D/C | ||||||||
| 93LC66BT-I/MC | - | - | - |